I believe what Nippon has developed is a more sag and creep resistant alloy. If that is the case then the original shape of the components would not change as much at high temperatures. This could aid in maintaining the original power of the package. Whatever that level was.
As to friction in the cystallographic structure at elevated temperatures causing a recordable loss in power I'd have to say that is a pretty week limb to be standing on.
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16 Cayman GT4, Carmine Red, Buckets, PCCB etc.
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